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KMID : 0385519910040030259
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Analytical Science & Technology
1991 Volume.4 No. 3 p.259 ~ p.266
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The Analysis of Trace Elements in Gold Bonding Wire for Senmiconductor by ICP-AES
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정상섭/Chung, Kang-Sup
성학제/이경애/김태삼/Sung, Hack-Je/Lee, Kyung-Ae/Kim, Tae-Sam
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Abstract
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ICP-AES, Gold bonding wire, Au-matrix elementation
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KEYWORD
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